印刷電路板組裝

Printed Circuit Board Assembly (PCBA)因應客戶不同的需求,廣宇的製造基地持續不斷的提升競爭力,同時在人員與設備上建構了高度的機動性與效率,先進的設備與專業的人員,可以支援各類複雜性高的產品技術要求。




PCBA Manufacturing廣宇在全球各地的生產基地建構相同的製造、測試、工程與品質體系平台,無論是因應降低成本和風險,配合客戶不同的交貨地點,或是災難應變處理計劃,廣宇的團隊能夠透過內部的通用平台在最短的時間內完成產品製造、技術、品質管理的順利轉移,強化全球整體營運。

PCBA capabilities include:

  • Board sizes up to 12” x14”
  • SMT, PTH, mixed technology
  • Double-sided PCBs
  • No clean, aqueous, lead-free & halogen free processing
  • RoHS compliant assembly
  • Ultra-fine pitch QFP, BGA, micro BGA
  • 0201 and 01005 component support
  • Chip shooters
  • Automated insertion
  • Conformal coating and potting
  • Flex circuits

BGA and Micro BGA Experts

  • Capable of 12 Mil Pitch (0.3mm) placement
  • Nearly 15 years experience with BGA’s
  • Approximately 30k+/month BGA placements
  • Largest number of BGA’s placed on one board – 60
  • Largest BGA placed on a board – 1,900 balls
  • BGA placement; top & bottom
  • BGA Re-Work station
  • 3D AOI inspection

Printed Circuit Board Assembly (PCBA)透過科學的教育訓練方式,廣宇持續不斷的強化與加深員工的品質觀念與行為,藉以維持高品質的製造技術與品質水準,提高客戶的滿意度與信賴度。





For additional information concerning specific support Pan can provide for your needs, please 聯絡我們.

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